Over the last 20 years, adhesives have been increasingly used in all areas of industry and manufacture for bonding joints and layers. Product research and development has concentrated mainly on achieving greater strength of adhesion in engineering joints, and the modification of adhesives to provide optimum performance on a wide range of material surfaces and in varying climatic conditions.

Now there is a remarkable new invention that dramatically enhances the commercial viability and practicality of using adhesives. It acts as a catalyst for faster curing of adhesives and also aids the moulding and extrusion of encapsulated adhesive trims. And most remarkably, it not only strengthens the physical chemical bond, but when an appropriate level of heat is applied, it also breaks it at the interfacing surfaces by reducing the cohesion.