De-Bonding Limited has patented and developed worldwide the revolutionary process of De-Bonding - the heat-triggered clean break of any adhesive bond between two surfaces. This is caused by thermo-expandable microspheres, which consist of an outer shell of copolymer thermoplastic resin with a core of blowing gas, explosive material or other volatile vaporising agent, by an appropriate level of heat, starting with infra red. The microspheres De-Bond - expand to over 100 times their volume, acting as a pressure activator to cleanly break the bond at the interface, and the cohesive structure.

Microspheres can be applied by adding to the adhesive, mixing with any cleaner or primer, or directly applied at the interface between two layers. The microspheres will remain dormant until the precise heat range is applied at command, with proven efficiency, even after a dormancy of 10 years plus. The system is activated and proven. The levels of gas, explosive or volatile agent within the shell depends upon the cohesive structure of the adhesive to be De-Bonded. In turn, the formulation of the microspheres determines the level of heat required to cause De-Bonding with near zero load lift.

In all instances the process is fast, totally safe and virtually silent, with both the microspheres and the flakes of cottonwool-like residue left after De-Bonding completely safe, posing no health or environmental hazard. The residue is easily and quickly removed. In instances such as the changing of a damaged windscreen, removal by De-Bonding as opposed to conventional methods represents a massivesaving in time and clean-up costs. It also eliminates the risk of breakage which could cause problems with windscreens still under manufacturer's warranty.